For Hi-Reliability and Mission Critical Boards or as a method to help with your Vendor Qualification process, Baknor utilizes Interconnect Stress Testing (IST).

Interconnect Stress Test (IST) is an accelerated stress test method used to evaluate the integrity of the PCB interconnect structure. It's an objective test whose results are timely, repeatable, reproducible and unique.

IST is an approved (TM-650 2.6.26) test method, it's experiencing rapidly growing acceptance by most major OEMs, CEM and PCB manufacturers as a definite method for the measurement of PCB interconnect integrity.